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August 13, 2012

Zalman will release housing Z9PLUS-D IV-U3


The company, in collaboration with Zalman Dospara going to release a new Mid-Tower chassis Z9PLUS-D IV-U3. The letter "D" in the model name represents Dospara, which itself is a fully developed design of the front panel of new items.


Steel chassis supports the installation of motherboard form factor micro-ATX and ATX. The front panel offers two ports USB 3.0, two USB 2.0 ports and two audio jacks.


Inside is enough room to two 5.25-inch, six 3.5-inch and one 2.5-inch devices. The case has seven expansion slots.

During the cooling fan inside there are four top, front, rear and side. All of them are 120 mm in diameter and have a blue backlight.

In the sale of housing Z9PLUS-D IV-U3 will come on August 19. Price new is 5.980 yen (about $ 76).

Source: Techfresh.net

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